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Modular Intelligent Assembly machine for single-chip back glue mobile phone shell


The company makes use of advanced digital intelligent manufacturing technology to meet the customer's personalized needs at the fastest speed to improve customer satisfaction and ensure the continuous competitiveness of the enterprise.
Parameter description

1. 电源功率:AC220V/50HZ,3.5kw;

2. 气压:5.5-6BAR(0.55-0.6Mpa);

3. CCD视觉定位;

4. 全伺服机械手调节贴合位置;

5. 设备装配精度:+/-0.10mm;

6. 设备装配效率:700-900pcs/hour;

7. 设备装配良率: 大于98%;

8. 适于手机、中小平板类的大背胶或大石墨辅料类的贴合,背胶等以单片弹夹上料,自动撕底膜,贴合。可以与前壳自动线联机,增加压合,撕上保护膜等机台

 


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