1. Appearance inspection of electronic components
Detect the appearance of small electronic components, such as SMD products, silicon wafers
After taking high-speed and automatic photographs of the surface of the measured object, the data are transmitted to a computer for processing, and the defective products are found, the types of defects include typographical errors, content errors, image errors, direction errors, missed prints, surface defects and so on.
2.Chip appearance detection
Test IC chip size, appearance, flatness and so on
Detect the number of pins and the geometric size of pins in multiple positions, including pitch interval, width, height, bending, etc. . It can detect the appearance of the chip continuously, efficiently and quickly, improve the detection efficiency, save the labor cost and reduce the labor intensity.
3.PCB printed circuit inspection
Detect the size, position and defect of PCB
Detect PCB components position, solder joint, circuit, hole size, angle measurement, computer micro-communication interface, SIM card slot, SMT component placement, surface mount, surface detection; SPI solder paste detection, reflow soldering and wave soldering; cable joint number and other detection and measurement.
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